4,4′-Bis(4-aminophenoxy)biphenyl (BAPB)

Basic Information of BAPB

Product Name	4,4'-Bis(4-aminophenoxy)biphenyl
Abbreviation	BAPB
CAS Number	13080-85-8
Product Type	Ether-containing biphenyl aromatic diamine monomer
Molecular Formula	C24H20N2O2
Molecular Weight	368.43 g/mol
Appearance	White to gray or reddish powder or crystal
Purity	≥ 99%; batch data should be confirmed when quality documentation is available
Main Application	Heat-resistant, processable and specialty polyimide synthesis
Package	1 kg/bottle, 20 kg/drum, or customized packaging
Documents	SDS, TDS and available product information upon request
Storage	Keep sealed, dry, and away from moisture
Molecular Structure

Key Features in Polyimide Design

• Ether-containing biphenyl diamine structure, relevant to heat-resistant and processable polyimide diamine monomers.

• Rigid biphenyl core may support mechanical strength, thermal resistance and dimensional stability depending on the paired dianhydride and polymer architecture.

• Phenoxy linkages may improve chain mobility, processability and film-forming behavior compared with fully rigid aromatic structures.

• BAPB can be considered in specialty functional polymer formulations where aromatic rigidity and processability need to be balanced.

• Final material properties depend on monomer purity, dianhydride selection, solvent system, imidization conditions and polymer processing method.

Pairing BAPB with Dianhydride Monomers

In polyimide synthesis, BAPB may be evaluated with selected polyimide dianhydride monomers to design heat-resistant, processable and mechanically robust PI systems. Rigid aromatic dianhydrides such as BPDA CAS 2420-87-3 or BTDA CAS 2421-28-5 may support thermal resistance and dimensional stability.

Ether-containing dianhydrides such as ODPA CAS 1823-59-2 may further support processability and film-forming behavior, while fluorinated dianhydrides such as 6FDA CAS 1107-00-2 may be considered when dielectric, optical or moisture-related properties are part of the target polymer design.

Application Context of BAPB in Polyimide Systems

BAPB is typically used as a structural diamine monomer rather than a finished application material. It is commonly discussed in heat-resistant, processable, electronic-grade and specialty polyimide material development, where biphenyl rigidity and ether-linkage flexibility can influence polymer performance.

• High-temperature polyimide applications – thermal resistance and high-performance polymer environments.

• Electronics and semiconductor polyimide applications – dielectric, insulation and thermally stable material requirements.

• Flexible and processable polyimide systems – solubility, chain flexibility and film formation considerations.

• Specialty functional polymer formulations – ether-containing biphenyl diamine selection for advanced polymer research.

Related Polyimide Monomer Supply Guides

For a broader technical overview of both diamine and dianhydride monomer families, please review Polyimide Monomers: Diamines and Dianhydrides.

Related Polyimide Monomers

• BAPP CAS 13080-86-9 – ether-containing aromatic diamine for processable and heat-resistant polyimide systems.

• BPDA CAS 2420-87-3 – rigid aromatic dianhydride for low-CTE and high-temperature PI films.

• ODPA CAS 1823-59-2 – ether-containing dianhydride for processable and flexible PI systems.

SDS, TDS and Technical Documentation

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