3,3′,4,4′-Biphenyltetracarboxylic dianhydride (s-BPDA)

Basic Information of s-BPDA

Product Name	3,3',4,4'-Biphenyltetracarboxylic dianhydride
Abbreviation	BPDA / s-BPDA
CAS Number	2420-87-3
Product Type	Rigid aromatic dianhydride monomer
Molecular Formula	C16H6O6
Molecular Weight	294.22 g/mol
Appearance	White powder
Purity	≥ 99.9%
Melting Point	≥ 298°C
Metal Testing	Single metal ≤ 500 ppb; total metal ≤ 1 ppm;
Main Application	Low-CTE, high-temperature and electronic-grade polyimide synthesis
Package	1 kg/bottle, 20 kg/drum, or customized packaging
Documents	COA, SDS and TDS available upon request
Molecular Structure

Typical Specification of BPDA / s-BPDA

The above data is based on an available batch COA for BPDA / s-BPDA CAS 2420-87-3. Final specifications, batch data and documentation should be confirmed by the latest COA before order confirmation.

Key Features in Polyimide Design

• Rigid biphenyl dianhydride structure, relevant to  polyimide dianhydride monomers  used in low-CTE and high-temperature PI systems.

• Linear and rigid aromatic structure may support dimensional stability and low coefficient  of thermal expansion depending on the paired diamine and processing method.

• High-purity and low-metal-control requirements may be important for electronic-grade,  flexible substrate and specialty polyimide material development.

• BPDA-based PI systems are commonly discussed in  electronics and microelectronics polyimide applications  where dimensional stability, insulation and thermal endurance are important.

• Final material properties depend on dianhydride purity, diamine selection, solvent system,  imidization conditions, film orientation and polymer processing method.

Pairing BPDA with Diamine Monomers

In polyimide synthesis, BPDA may be evaluated with selected polyimide diamine monomers supply portfolio to design low-CTE, high-temperature and dimensionally stable PI systems. Rigid aromatic diamines may support thermal resistance and mechanical strength, while ether-containing diamines may help improve processability and film-forming behavior.

Fluorinated diamines such as TFMB / TFDB CAS 341-58-2 can be considered when the formulation requires additional control of dielectric behavior, optical performance or moisture uptake. Ether-containing diamines such as BAPP CAS 13080-86-9 may support processability and flexibility in selected PI systems.

Application Context of BPDA in Polyimide Systems

BPDA is typically used as a structural dianhydride monomer rather than a finished application material. It is commonly considered in low-CTE, high-temperature, electronic-grade and specialty polyimide material development, where dimensional stability, thermal resistance and mechanical performance are important design factors.

• High-temperature aerospace polyimide insulation systems  – heat-resistant insulation and structural polymer environments.

• Electronics and microelectronics polyimide applications  – low-CTE, insulation and thermally stable PI material design.

• Low-CTE polyimide films and flexible substrates – BPDA-based systems may be considered  where dimensional stability during thermal processing is important.

• Specialty high-performance polymer systems – BPDA can be evaluated in research contexts  where rigidity, heat resistance and mechanical integrity need to be balanced.

Related Polyimide Monomer Supply Guides

For a broader technical overview of both diamine and dianhydride monomer families, please review Polyimide Monomers: Diamines and Dianhydrides.

Related Polyimide Monomers

• BTDA CAS 2421-28-5  – benzophenone-type aromatic dianhydride for thermally stable PI resins and coatings.

• ODPA CAS 1823-59-2  – ether-containing dianhydride for processable and flexible PI systems.

• TFMB / TFDB CAS 341-58-2  – fluorinated diamine for transparent, low-dielectric and high-performance PI systems.

COA, SDS and Technical Documentation

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