1,3-Bis(3-aminophenoxy)benzene (APB)

Basic Information of APB

Product Name	1,3-Bis(3-aminophenoxy)benzene
Abbreviation	APB
CAS Number	10526-07-5
Molecular Formula	C18H16N2O2
Molecular Weight	292.33 g/mol
Appearance	White to light yellow to light orange powder to crystal
Purity	≥99%
Package	1kg/bottle, 20kg/drum, or customized
Molecular Structure

Key Properties

• High-performance polyimide and copolyimide resins

• Advanced engineering polymers and composite materials

• Electronics insulating films and microelectronic materials withinpolyimide material systems used in electronics and semiconductor processing

• Specialty polymers in aerospace, coatings, adhesives asfunctional polyimide formulations

• Research & development monomer for novel polymer systems

Key Applications of APB

• High-Performance Polymers: Serves as a monomer for polyimides, poly(ether ether ketone amide)s (PEEKAs), and copolymers, offering high glass transition temperatures (190–220°C) and thermal decomposition above 500°C, supportingpolyimide materials evaluated for high-temperature environments.

• Electronics and Electrical Insulation: Incorporated into polyimides for flexible copper clad laminates (FCCL) and semiconductor-related sheets, withinpolyimide material systems studied for electronics and semiconductor processing environments.

• Aerospace and Automotive: Utilized as a structural contributor in high heat-resistant plastics and adhesive systems, aligning withhigh-temperature polyimide material research contexts.

• Coatings and Adhesives: Acts as a curing agent in epoxy resins and polyurethane coatings, contributing to toughness and flexibility inspecialty functional polymer formulations.

• Advanced Materials: Explored in composite materials and experimental polymer systems, including studies related toflexible and processable polyimide system development.