4,4′-Oxydiphthalic anhydride (ODPA)

Basic Information of ODPA

Product Name	4,4'-Oxydiphthalic anhydride
Abbreviation	ODPA
CAS Number	1823-59-2
Product Type	Ether-linked aromatic dianhydride monomer
Molecular Formula	C16H6O7
Molecular Weight	310.21 g/mol
Appearance	White to light yellow or light orange powder or crystal
Purity	≥ 99.5%; batch data should be confirmed when quality documentation is available
Main Application	Flexible, processable and electronic-grade polyimide synthesis
Package	1 kg/bottle, 20 kg/drum, or customized packaging
Documents	SDS, TDS and available product information upon request
Storage	Keep sealed, dry, and away from moisture
Molecular Structure

Key Features in Polyimide Design

• Ether-linked aromatic dianhydride structure, relevant to processable and flexible polyimide dianhydride monomers.

• Flexible ether linkage may help improve chain mobility, solubility and film-forming behavior depending on the paired diamine and polymer architecture.

• Aromatic dianhydride framework may support thermal resistance, chemical resistance and electrical insulation performance in selected polyimide systems.

• ODPA can be considered in flexible films, coatings and adhesives where processability, adhesion and film flexibility are important.

• Final material properties depend on dianhydride purity, diamine selection, solvent system, imidization conditions, film formation and polymer processing method.

Pairing ODPA with Diamine Monomers

Fluorinated diamines such as TFMB / TFDB CAS 341-58-2 may be considered when optical clarity, dielectric behavior or moisture-related properties are part of the target polymer design, while rigid aromatic diamines may be selected when dimensional stability and thermal resistance are more important.

Application Context of ODPA in Polyimide Systems

ODPA is typically used as a structural dianhydride monomer rather than a finished application material. It is commonly discussed in flexible, processable, electronic-grade and specialty polyimide material development, where ether-linked dianhydride structure can influence solubility, film formation, adhesion and polymer processing behavior.

• Flexible films, coatings and adhesives – processable PI systems where film formation, flexibility and adhesion are important.

• Electronics and microelectronics polyimide applications – insulation, dielectric behavior and electronic-grade film requirements.

• Aerospace and high-temperature insulation applications – thermally stable and mechanically reliable polymer environments.

• Energy storage and separation applications – functional polymer, membrane and electrochemical material research contexts.

• Specialty functional polyimide materials – ether-linked dianhydride selection for advanced polymer research and formulation design.

Related Polyimide Monomer Supply Guides

For a broader technical overview of both diamine and dianhydride monomer families, please review Polyimide Monomers: Diamines and Dianhydrides.

Related Polyimide Monomers

• BPADA CAS 38103-06-9 – bisphenol-A-based dianhydride for processable and flexible polyimide or polyetherimide systems.

• BAPP CAS 13080-86-9 – ether-containing aromatic diamine for flexible and processable polyimide systems.

• TPE-Q CAS 3491-12-1 – ether-containing aromatic diamine for processable and heat-resistant PI material design.

SDS, TDS and Technical Documentation

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